Methods for cell phasing and placement in dynamic array architecture and implementation of the same

ABSTRACT

A semiconductor chip is defined to include a logic block area having a first chip level in which layout features are placed according to a first virtual grate, and a second chip level in which layout features are placed according to a second virtual grate. A rational spatial relationship exists between the first and second virtual grates. A number of cells are placed within the logic block area. Each of the number of cells is defined according to an appropriate one of a number of cell phases. The appropriate one of the number of cell phases causes layout features in the first and second chip levels of a given placed cell to be aligned with the first and second virtual grates as positioned within the given placed cell.

CLAIM OF PRIORITY

This application is a continuation application under 35 U.S.C. 120 ofprior U.S. application Ser. No. 14/605,946, filed on Jan. 26, 2015,which is a continuation application under 35 U.S.C. 120 of prior U.S.application Ser. No. 14/040,590, filed Sep. 27, 2013, issued as U.S.Pat. No. 8,966,424, on Feb. 24, 2015, which is a continuationapplication under 35 U.S.C. 120 of prior U.S. application Ser. No.13/540,529, filed Jul. 2, 2012, issued as U.S. Pat. No. 8,549,455, onOct. 1, 2013, which is a continuation application under 35 U.S.C. 120 toprior U.S. application Ser. No. 12/497,052, filed Jul. 2, 2009, issuedas U.S. Pat. No. 8,214,778, on Jul. 3, 2012, which claims priority: 1)under 35 U.S.C. 119(e) to U.S. Provisional Patent Application No.61/081,370, filed Jul. 16, 2008, and 2) as a continuation-in-partapplication under 35 U.S.C. 120 to U.S. application Ser. No. 12/013,342,filed on Jan. 11, 2008, issued as U.S. Pat. No. 7,917,879, on Mar. 29,2011, which claims the benefit of both U.S. Provisional PatentApplication No. 60/963,364, filed on Aug. 2, 2007, and U.S. ProvisionalPatent Application No. 60/972,394, filed on Sep. 14, 2007. Thedisclosure of each above-identified patent application and patent isincorporated herein by reference in its entirety for all purposes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is also related to U.S. patent application Ser. No.11/683,402, filed on Mar. 7, 2007, and entitled “Dynamic ArrayArchitecture.” This application is also related to U.S. patentapplication Ser. No. 12/013,356, filed on Jan. 11, 2008, and entitled“Methods for Designing Semiconductor Device with Dynamic Array Section.”This application is also related to U.S. patent application Ser. No.12/013,366, filed on Jan. 11, 2008, and entitled “Methods for DefiningDynamic Array Section with Manufacturing Assurance Halo and ApparatusImplementing the Same.” The disclosures of the above-identified patentapplications are incorporated herein by reference.

BACKGROUND

In modern semiconductor chip (“chip”) design, standard cells are placedon the chip to define a particular logic function. To ensure that eachstandard cell will be manufacturable when arbitrarily placed on thechip, each standard cell is defined to have an edge exclusion zone sizedequal to one-half of a design rule (DR) spacing requirement betweenadjacent conductive features. In this manner, when any two standardcells are placed next to each other, their combined exclusion zone sizesat their interfacing boundaries will equal at least the DR spacingrequirement between adjacent conductive features. Thus, the exclusionzone enables features to be placed arbitrarily within a standard cellwithout concern for cell-to-cell interface problems. However, when manystandard cells are placed together on the chip, the edge exclusion zonesassociated with the standard cells can combine to occupy an expensiveamount of chip area.

In view of the foregoing, it is of interest to optimize cell layout andplacement such that chip area and routing resources can be mostefficiently utilized, particularly when cells are defined according to aconstrained layout architecture.

SUMMARY

In one embodiment, a semiconductor chip is disclosed. The semiconductorchip includes a logic block area. The logic block area includes a firstchip level in which layout features are placed according to a firstvirtual grate. The logic block area also includes a second chip level inwhich layout features are placed according to a second virtual grate. Arational spatial relationship exists between the first and secondvirtual grates. A number of cells are placed within the logic blockarea. Each of the number of cells is defined according to an appropriateone of a number of cell phases. The appropriate cell phase causes layoutfeatures in the first and second chip levels of a given placed cell tobe aligned with the first and second virtual grates as positioned withinthe given placed cell.

In another embodiment, a method is disclosed for defining cell variantsof different cell phase to enable placement of cells within a designatedarea of a semiconductor chip. The method includes an operation foridentifying a phase space for the designated area of the semiconductorchip. The phase space is defined as a distance extending perpendicularlybetween successive occurrences of a same relationship between the twovirtual grates that have a rational spatial relationship within thedesignated area of the semiconductor chip. The method also includes anoperation for aligning a left boundary of a subject cell with a leftedge of the phase space. With the left boundary of the subject cellaligned with the left edge of the phase space, an operation is performedto define a first phase of the subject cell based on locations of thetwo virtual grates relative to the left boundary of the subject cell.The first phase of the subject cell is stored in a cell library. Themethod further includes an operation for moving the left boundary of thesubject cell from its current position across the phase space to a nextpossible location of the left boundary of the subject cell within thephase space. With the left boundary of the subject cell aligned with thenext possible location, an operation is performed to define a next phaseof the subject cell based on locations of the two virtual gratesrelative to the left boundary of the subject cell. The next phase of thesubject cell is stored in the cell library. The method continues bymoving the left boundary of the subject cell to each of its possiblelocations within the phase space, and by defining and storing adifferent phase of the subject cell at each possible location of theleft boundary of the subject cell within the phase space.

In another embodiment, a method is disclosed for placing cells within adesignated area of a semiconductor chip. The method includes anoperation for defining respective virtual grates for each of two phasedchip levels within the designated area of the semiconductor chip. Thevirtual grates of the two phased chip levels are defined to have arational spatial relationship. The method also includes an operation forplacing cells within the designated area of the semiconductor chip. Themethod further includes an operation for determining a required cellphase for each placed cell within the designated area of thesemiconductor chip. For each placed cell within the designated area ofthe semiconductor chip, an operation is performed to substitute avariant of the placed cell having the required cell phase, such thatlayout features in each of the two phased chip levels within thesubstituted variant of the placed cell align with the virtual grates ofthe two phased chip levels.

In one embodiment, a computer readable storage medium is disclosed toinclude a semiconductor chip layout recorded in a digital format. Thesemiconductor chip layout includes a logic block area including a firstchip level in which layout features are placed according to a firstvirtual grate. The semiconductor chip layout also includes a second chiplevel in which layout features are placed according to a second virtualgrate. A rational spatial relationship exists between the first andsecond virtual grates. The semiconductor chip layout further includes anumber of cells placed within the logic block area. Each of the numberof cells is defined according to an appropriate one of a number of cellphases. The appropriate one of the number of cell phases causes layoutfeatures in the first and second chip levels of a given placed cell tobe aligned with the first and second virtual grates as positioned withinthe given placed cell.

In one embodiment, a cell library stored in a digital format on acomputer readable storage medium is disclosed. The cell library includesa plurality of cell layouts corresponding to different phases of a givencell. The given cell includes at least one chip level in which layoutfeatures are placed in accordance with a virtual grate. The virtualgrate is defined by a set of parallel equally spaced virtual linesextending across the cell layout. Each different phase of the given cellis defined by a different spacing between a reference cell boundary anda nearest virtual line of the virtual grate.

Other aspects and advantages of the invention will become more apparentfrom the following detailed description, taken in conjunction with theaccompanying drawings, illustrating by way of example the presentinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is an illustration showing a semiconductor chip defined toinclude a logic block, in accordance with one embodiment of the presentinvention;

FIG. 1B is an illustration showing placement of cells in the logicblock, in accordance with one embodiment of the present invention;

FIG. 2A is an illustration showing the logic block area of the chiphaving two separate virtual grates defined thereover, in accordance withone embodiment of the present invention;

FIG. 2B is an illustration showing the exemplary logic block inconjunction with the gate level and M2 level virtual grates, which areindexed to the origin at the lower-left corner of the logic block, inaccordance with one embodiment of the present invention;

FIG. 2C is an illustration showing the cell placement of FIG. 2B, withan appropriate cell variant substituted for each cell based on therequired cell phasing for the various cell placements within the logicblock, in accordance with one embodiment of the present invention;

FIGS. 3A-3H are illustrations showing different cell phases that mayexist for a cell placed in the logic block of FIG. 2A, in accordancewith one embodiment of the present invention;

FIGS. 3I-3P are illustrations showing different cell phases in whichvirtual grates are phased with each other without actually aligning witheach other, in accordance with one embodiment of the present invention;

FIG. 4 is an illustration showing Row 1 of the logic block of FIG. 2C,with exemplary gate level and M2 level layout shapes depicted for eachcell therein, in accordance with one embodiment of the presentinvention;

FIG. 5 is an illustration showing a flowchart of a method for definingcell variants of differing cell phase to enable placement of cellswithin an area on a semiconductor chip defined according to a dynamicarray architecture, in accordance with one embodiment of the presentinvention;

FIG. 6 is an illustration showing a flowchart of a method for placingcells within a portion of a semiconductor chip defined according to adynamic array architecture, in accordance with one embodiment of thepresent invention;

FIG. 7 is an illustration showing an example of different phasings in asecond interconnect level of adjacently disposed logic cells definedwithin a DAS, in accordance with one embodiment of the presentinvention;

FIG. 8 shows an example of virtual lines defined within the dynamicarray architecture, in accordance with one embodiment of the presentinvention; and

FIG. 9 shows a computer readable medium, in accordance with oneembodiment of the present invention.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the present invention. Itwill be apparent, however, to one skilled in the art that the presentinvention may be practiced without some or all of these specificdetails. In other instances, well known process operations have not beendescribed in detail in order not to unnecessarily obscure the presentinvention.

FIG. 1A is an illustration showing a semiconductor chip (“chip”) 101defined to include a logic block 103, in accordance with one embodimentof the present invention. The logic block 103 includes integratedcircuit devices in the form of multi-level structures defined on asilicon substrate of the chip 101. At a substrate level, transistordevices with diffusion regions are formed. In subsequent levels,interconnect metallization lines are patterned and electricallyconnected to the transistor devices to define a desired integratedcircuit device. Also, patterned conductive layers are insulated fromother conductive layers by dielectric materials. The structural featuresused to define the diffusion regions, transistor devices, metallizationlines, interconnects, etc. within each level of the chip 101 are definedaccording to a specified layout. Additionally, the global layout for agiven level of the chip 101 may be segmented into many small layoutareas, where each layout area is associated with a given logicconstruct. Moreover, layout areas within multiple levels of the chip 101within a given vertical column of the chip 101 can be integratedtogether to form a logic unit referred to as a cell.

A cell, as referenced herein, represents an abstraction of a logicfunction, and encapsulates lower-level integrated circuit layouts forimplementing the logic function. It should be understood that a givenlogic function can be represented by multiple cell variations, whereinthe cell variations may be differentiated by feature size, performance,and process compensation technique (PCT) processing. For example,multiple cell variations for a given logic function may bedifferentiated by power consumption, signal timing, current leakage,chip area, OPC (optical proximity correction), RET (reticle enhancementtechnology), etc. It should also be understood that each celldescription includes the layouts for the cell in each level of a chipwithin the associated vertical column of the chip, as required toimplement the logic function of the cell. More specifically, a celldescription includes layouts for the cell in each level of the chipextending from the substrate level up through a particular interconnectlevel.

In one embodiment, the logic block 103 is defined by placing a number ofcells of various logic function in rows within the logic block 103. Forexample, consider that a number of cells A-Z are available for usewithin the logic block 103, where each of cells A-Z is defined toperform a different logic function. In this exemplary embodiment, thelogic block 103 may be defined by placement of cells A-Z within rows1-10 of the logic block 103, as shown in FIG. 1B. In this exemplaryembodiment, the width of the cells as measured from left-to-right acrossa given row can vary from cell-to-cell. However, the height of the cellsas measured vertically within a given row is essentially the same fromcell-to-cell, thereby allowing the logic block 103 to be populated byadjacently defined rows of cells of consistent height. Also, in someembodiments, the height of cells may vary from row-to-row and/or withina row.

A dynamic array architecture represents a semiconductor device designparadigm in which layout features are defined along a regular-spacedvirtual grate (or regular-spaced virtual grid) in a number of levels ofa cell, i.e., in a number of levels of a semiconductor chip, such aschip 101. The virtual grate is defined by a set of equally spaced,parallel virtual lines extending across a given level in a given chiparea. The equal spacing, as measured perpendicularly between adjacentvirtual lines of the virtual grate, is defined as the virtual gratepitch. For example, FIG. 2A shows the logic block 103 area of the chip101 having two separate virtual grates defined thereover, in accordancewith one embodiment of the present invention. More specifically, onevirtual grate is defined over the logic block 103 for the gate level ofthe chip 101, and another virtual grate is defined over the logic block103 for the second interconnect level (M2 level) of the chip 101.

In one embodiment, the virtual grate of a given level is oriented to besubstantially perpendicular to the virtual grate of an adjacent level.For example, in this embodiment, a virtual grate for the firstinterconnect level (M1 level) (not shown) extends in a directionperpendicular to both the gate level and M2 level virtual grates.However, it should be appreciated, that in some embodiments, the virtualgrate of a given level may be oriented either perpendicular or parallelto the virtual grate of an adjacent level.

In one embodiment, each virtual grate within various levels of the chipis indexed to an origin of a single coordinate system. Therefore, thecoordinate system enables control of a spatial relationship between thevirtual grates within the various levels of the chip. For example, inthe exemplary embodiment of FIG. 2A, each of the gate level and M2 levelvirtual grates is indexed to an origin (0,0) of a coordinate system,where the origin (0,0) is located at a lower-left corner of the logicblock 103 area on the chip 101. It should be understood that the origin(0,0) of the coordinate system can be located at any location on thechip 101, and is not required to be located at a particular position ofa logic block in which cells are to be placed (e.g., at the lower-leftcorner of the logic block 103). Also, it should be understood thatindexing of a virtual grate to a given spatial location means that thevirtual grate is defined such that one of its virtual lines passesthrough the given spatial location.

The spatial relationship between virtual grates in various levels of thechip can be defined in essentially any number of ways. However, thespatial relationship between commonly oriented (i.e., parallel indirection of extent across the chip) virtual grates can be defined by arational number, such that the virtual grates align with each other at aparticular spatial frequency. Specifically, for any two virtual gratesthat are indexed to the origin of the same coordinate system, a ratio oftheir virtual grate pitches can be defined by a rational number, suchthat the two virtual grates align at a particular spatial frequency. Forexample, FIG. 2A shows that the spatial relationship between the M2level and gate level virtual grates is defined by a M2 level-to-gatelevel virtual grate pitch ratio of 4/3. Thus, the M2 level and gatelevel virtual grates align with each other at every fourth gate levelvirtual grate line relative to the origin (0,0). Two virtual grates thatare commonly oriented, indexed to a common spatial location, and havethe ratio of their virtual grate pitches defined by a rational numberare considered to have a rational spatial relationship.

FIG. 8 shows an example of virtual lines 801A-801E defined within thedynamic array architecture, in accordance with one embodiment of thepresent invention. Virtual lines 801A-801E extend across the layout in aparallel manner, with a perpendicular spacing therebetween equal to aspecified pitch 807. For illustrative purposes, complementary diffusionregions 803 and 805 are shown in FIG. 8. It should be understood thatthe diffusion regions 803 and 805 are defined in a diffusion level belowa gate level. Also, it should be understood that the diffusion regions803 and 805 are provided by way of example and in no way represent anylimitation on diffusion region size, shape, and/or placement within thediffusion level relative to the dynamic array architecture.

Within the dynamic array architecture, a feature layout channel isdefined about a given virtual line so as to extend between virtual linesadjacent to the given virtual line. For example, feature layout channels801A-1 through 801E-1 are defined about virtual lines 801A through 801E,respectively. It should be understood that each virtual line has acorresponding feature layout channel. Also, for virtual lines positionedadjacent to an edge of a prescribed layout space, e.g., adjacent to acell boundary, the corresponding feature layout channel extends as ifthere were a virtual line outside the prescribed layout space, asillustrated by feature layout channels 801A-1 and 801E-1. It should befurther understood that each feature layout channel is defined to extendalong an entire length of its corresponding virtual line.

FIG. 8 further shows a number of exemplary layout features 809-823defined in accordance with the feature layout channels 801A-1 through801E-1 corresponding to virtual lines 801A through 801E, respectively.Within the dynamic array architecture, layout features associated with agiven virtual line are defined within the feature layout channelassociated with the virtual line. Also, physical contact is prohibitedbetween layout features defined in feature layout channels that areassociated with adjacent virtual lines.

A contiguous layout feature can include both a portion which defines anactive part of a circuit, and a portion that does not define a part ofthe circuit. For example, in the gate level, a contiguous layout featurecan extend over both a diffusion region and a dielectric region of anunderlying chip level. In one embodiment, each portion of a gate levellayout feature that forms a gate electrode of a transistor is positionedto be substantially centered upon a given virtual line. Furthermore, inthis embodiment, portions of the gate level layout feature that do notform a gate electrode of a transistor can be positioned within thefeature layout channel associated with the given virtual line.Therefore, a given gate level layout feature can be defined essentiallyanywhere within a feature layout channel, so long as gate electrodeportions of the given gate level layout feature are centered upon thevirtual line corresponding to the given feature layout channel, and solong as the given gate level layout feature complies with design rulespacing requirements relative to other gate level layout features inadjacent feature layout channels.

As shown in FIG. 8, the layout feature 809 is defined within the featurelayout channel 801A-1 associated with virtual line 801A. Some portionsof layout feature 809 are substantially centered upon the virtual line801A. Also, other portions of layout feature 809 maintain design rulespacing requirements with layout features 811 and 813 defined withinadjacent feature layout channel 801B-1. Similarly, layout features811-823 are defined within their respective feature layout channel, andinclude portions substantially centered upon the virtual linecorresponding to their respective feature layout channel. Also, itshould be appreciated that each of layout features 811-823 maintainsdesign rule spacing requirements with layout features defined withinadjacent feature layout channels, and avoids physical contact with anyother layout feature defined within adjacent feature layout channels.

As illustrated by the example feature layout channels 801A-1 through801E-1 of FIG. 8, each feature layout channel is associated with a givenvirtual line and corresponds to a layout region that extends along thegiven virtual line and perpendicularly outward in each opposingdirection from the given virtual line to a closest of either an adjacentvirtual line or a virtual line outside a layout boundary. Also, itshould be understood that each layout feature is defined within itsfeature layout channel without physically contacting another layoutfeature defined within an adjoining feature layout channel.

Some layout features may have one or more contact head portions definedat any number of locations along their length. A contact head portion ofa given layout feature is defined as a segment of the layout featurehaving a height and a width of sufficient size to receive a contactstructure, wherein “width” is defined across the substrate in adirection perpendicular to the virtual line of the given layout feature,and wherein “height” is defined across the substrate in a directionparallel to the virtual line of the given layout feature. It should beappreciated that a contact head of a layout feature, when viewed fromabove, can be defined by essentially any layout shape, including asquare or a rectangle. Also, depending on layout requirements andcircuit design, a given contact head portion of a layout feature may ormay not have a contact defined thereabove.

In one embodiment, the layout features are defined to provide a finitenumber of controlled layout shape-to-shape lithographic interactionswhich can be accurately predicted and optimized for in manufacturing anddesign processes. In this embodiment, the layout features are defined toavoid layout shape-to-shape spatial relationships which would introduceadverse lithographic interaction within the layout that cannot beaccurately predicted and mitigated with high probability. However, itshould be understood that changes in direction of layout features withintheir feature layout channels are acceptable when correspondinglithographic interactions are predictable and manageable.

In one embodiment, each layout feature of a given level is substantiallycentered upon one of the virtual lines of the virtual grate associatedwith the given level. A layout feature is considered to be substantiallycentered upon a particular line of a virtual grate when a deviation inalignment between of the centerline of the layout feature and theparticular line of the virtual grate is sufficiently small so as to notreduce a manufacturing process window from what would be achievable witha true alignment between of the centerline of the layout feature and theline of the virtual grate. Therefore, in this embodiment, layoutfeatures placed in different chip levels according to virtual grates ofrational spatial relationship will be aligned at a spatial frequencydefined by the rational spatial relationship. In one embodiment, theabove-mentioned manufacturing process window is defined by alithographic domain of focus and exposure that yields an acceptablefidelity of the layout feature. In one embodiment, the fidelity of alayout feature is defined by a characteristic dimension of the layoutfeature.

In the dynamic array architecture, variations in a verticalcross-section shape of an as-fabricated layout feature can be toleratedto an extent, so long as the variation in the vertical cross-sectionshape is predictable from a manufacturing perspective and does notadversely impact the manufacture of the given layout feature or itsneighboring layout features. In this regard, the vertical cross-sectionshape corresponds to a cut of the as-fabricated layout feature in aplane perpendicular to both the centerline of the layout feature and thesubstrate of the chip. It should be appreciated that variation in thevertical cross-section of an as-fabricated layout feature along itslength can correspond to a variation in width of the layout featurealong its length. Therefore, the dynamic array architecture alsoaccommodates variation in the width of an as-fabricated layout featurealong its length, so long as the width variation is predictable from amanufacturing perspective and does not adversely impact the manufactureof the layout feature or its neighboring layout features.

Additionally, different layout features within a given level can bedesigned to have the same width or different widths. Also, the widths ofa number of layout features defined along adjacent lines of a givenvirtual grate can be designed such that the number of layout featurescontact each other so as to form a single layout feature having a widthequal to the sum of the widths of the number of layout features.

Within a given level defined according to the dynamic arrayarchitecture, proximate ends of adjacent, co-aligned linear-shapedlayout features may be separated from each other by a substantiallyuniform gap. More specifically, adjacent ends of linear-shaped layoutfeatures defined along a common line of a virtual grate are separated byan end gap, and such end gaps within the level associated with thevirtual grate may be defined to span a substantially uniform distance.Additionally, in one embodiment, a size of the end gaps is minimizedwithin a manufacturing process capability so as to optimize filling of agiven level with linear-shaped layout features.

Also, in the dynamic array architecture, a level can be defined to haveany number of virtual grate lines occupied by any number of layoutfeatures. In one example, a given level can be defined such that alllines of its virtual grate are occupied by at least one layout feature.In another example, a given level can be defined such that some lines ofits virtual grate are occupied by at least one layout feature, and otherlines of its virtual grate are vacant, i.e., not occupied by any layoutfeatures. Furthermore, in a given level, any number of successivelyadjacent virtual grate lines can be left vacant. Also, the occupancyversus vacancy of virtual grate lines by layout features in a givenlevel may be defined according to a pattern or repeating pattern acrossthe given level.

Additionally, within the dynamic array architecture, vias and contactsare defined to interconnect a number of the layout features in variouslevels so as to form a number of functional electronic devices, e.g.,transistors, and electronic circuits. Layout features for the vias andcontacts can be aligned to a virtual grid, wherein a specification ofthis virtual grid is a function of the specifications of the virtualgrates associated with the various levels to which the vias and contactswill connect. Thus, a number of the layout features in various levelsform functional components of an electronic circuit. Additionally, someof the layout features within various levels may be non-functional withrespect to an electronic circuit, but are manufactured nonetheless so asto reinforce manufacturing of neighboring layout features.

It should be understood that the dynamic array architecture is definedto enable accurate prediction of semiconductor device manufacturabilitywith a high probability, even when layout features of the semiconductordevice are sized smaller than a wavelength of light used to render thelayout features in a lithographic manufacturing process. Additionally,it should be understood that the dynamic array architecture is definedby placement of layout features on a regular-spaced grate (orregular-spaced grid) in a number of levels of a cell, such that layoutfeatures in a given level of the cell are confined within their featurelayout channel, and such that layout features in adjacent feature layoutchannels do not physically contact each other. Furthermore, it should beunderstood that the dynamic array architecture can be applied to one ormore chip levels. For example, in one embodiment, only the gate level ofthe chip is defined according to the dynamic array architectures. Inanother embodiment, the gate level and one or more interconnect levelsare defined according to the dynamic array architecture.

With reference back to FIG. 1B, the exemplary logic block 103 is definedby placement of cells A-Z within rows 1-10. FIG. 2B is an illustrationshowing the exemplary logic block 103 in conjunction with the gate leveland M2 level virtual grates, which are indexed to the origin (0,0) atthe lower-left corner of the logic block 103. In one embodiment of thedynamic array architecture, in order for each of cells A-Z to beplaceable within the logic block 103, each of cells A-Z should bedefined based on use of the gate level and M2 level virtual grates ofthe logic block 103. However, depending on where a cell is placed in thelogic block 103, a position of the gate level and M2 level virtualgrates may vary within the boundaries of the cell, and relative to theboundaries of the cell. For example, a distance between the leftboundary of the cell and the nearest gate level virtual grate linewithin the cell can vary between different positions of the cell in thelogic block 103. Similarly, a distance between the left boundary of thecell and the nearest M2 level virtual grate line within the cell canvary between different positions of the given cell in the logic block103.

Each cell placed within the logic block 103 should have its cell-basedgate level and M2 level virtual grates aligned with the gate level andM2 level virtual grates of the logic block 103. Because the position ofthe gate level and M2 level virtual grates of the logic block 103 canvary within a given cell depending on where the given cell is placed inthe logic block 103, it is necessary to have different versions of thegiven cell available for placement in the logic block 103, such that atleast one version of the given cell is defined to have its gate leveland M2 level virtual grates respectively align with the gate level andM2 level virtual grates of the logic block 103.

Generally speaking, each cell is defined to have a width that is aninteger multiple of either a virtual grate pitch, or one-half of avirtual grate pitch, to enable alignment of the cell boundaries toeither a virtual grate line or a midpoint between adjacent virtual gratelines. In one embodiment, each cell is defined to have a width that isan integer multiple of one-half of the gate level virtual grate pitch.In another embodiment, each cell is defined to have a width that is aninteger multiple of the gate level virtual grate pitch. Additionally,each cell can be placed in the logic block 103 such that its left cellboundary is aligned with either a gate level virtual grate line or amidpoint between adjacent gate level virtual grate lines. Therefore,when the cell width is an integer multiple of one-half of the gate levelvirtual grate pitch, the right cell boundary will also be aligned witheither a gate level virtual grate line or a midpoint between adjacentgate level virtual grate lines. For ease of discussion, placement of acell such that its left cell boundary is aligned with either a gatelevel virtual grate line or a midpoint between adjacent gate levelvirtual grate lines is referred to as placement of the cell on the gatelevel virtual grate half-pitch.

Placement of cells on the gate level virtual grate half-pitch incombination with the rational spatial relationship between the gatelevel and M2 level virtual grates enables creation of a finite number oflayout variations for a given cell, such that a suitable layoutvariation for the given cell is available for each possible combinationof gate level and M2 level virtual grate placements that may occurwithin the given cell, depending upon where the given cell is placed inthe logic block 103. In this regard, each layout variation for a givencell defines a cell phase, wherein each cell phase is defined by adifferent combination of gate level and M2 level virtual grateplacements within the given cell relative to a reference boundary of thegiven cell, e.g., relative to the left boundary of the given cell.

It should be understood that in the above-described embodiment, thewidth of each cell is an integer multiple of the gate level virtualgrate half-pitch, but not necessarily an integer multiple of the M2level virtual grate pitch. Therefore, although the left and right cellboundaries will align with the gate level virtual grate, the left andright cell boundaries may not always align with the M2 level virtualgrate. However, the cell phasing methods described herein allow forplacement of active M2 level layout shapes on the M2 level virtualgrate. Therefore, the cell phasing and cell placement methods describedherein, in conjunction with the dynamic array architecture, serve tooptimize routing resources by not having an M2 level layout shape placedbetween adjacent M2 level virtual grate lines so as to consume the twoadjacent M2 level virtual grate lines with one M2 level layout shape.

FIGS. 3A-3H illustrate different cell phases that may exist for a cellplaced under the following conditions:

-   -   1. The cell is placed in a logic block defined according to the        dynamic array architecture where the rational spatial        relationship between the M2 level and gate level virtual grates        is defined by a M2 level-to-gate level virtual grate pitch ratio        of 4/3;    -   2. The cell is placed on the gate level virtual grate        half-pitch; and    -   3. The cell width is an integer multiple of one-half of the gate        level virtual grate pitch.

It should be understood that the cell phasing principles illustrated inFIGS. 3A-3H can be applied to any combination of commonly oriented chiplevels (i.e., beyond the illustrated gate and M2 levels) having anyrational spatial relationship (i.e., beyond the 4/3 M2-to-gate pitchratio), so long as the virtual grates of the logic block that areassociated with the cell phasing are indexed to a common spatiallocation.

FIG. 3A shows a first phase (ph1) of a cell 300. The cell 300 includes aleft cell boundary 301. The cell 300 is defined by a gate level virtualgrate represented by commonly oriented solid lines, and by a M2 levelvirtual grate represented by commonly oriented dashed lines. The pitchratio between the M2 level and gate level virtual grates is 4/3.Therefore, the M2 level and gate level virtual grate will align witheach other at every fourth gate level virtual grate line. The number ofgate level virtual grate lines between alignment of the gate level andM2 level virtual grates defines a phase space 303. Generally speaking, aphase space is defined as a distance extending perpendicularly betweensuccessive occurrences of a same relationship between the two virtualgrates that have a rational spatial relationship. In the exemplaryembodiment of FIGS. 3A-3H the successive occurrences of a samerelationship between the two virtual grates that have a rational spatialrelationship correspond to successive alignments of the two virtualgrates that have the rational spatial relationship.

Each cell phase is associated with a different allowed position of theleft cell boundary 301 (e.g., reference cell boundary) within the phasespace 303. In the example of FIGS. 3A-3H, the left cell boundary 301 canbe placed on the gate level virtual grate half-pitch. Therefore, theleft cell boundary 301 can be placed on each gate level virtual grateline within the phase space 303, and at the midpoint between adjacentgate level virtual grate lines within the phase space 303. Therefore,because the phase space 303 covers four gate level virtual grate pitchesand because the cell can be placed on the gate level virtual gratehalf-pitch, the number of possible cell phases is eight. In FIGS. 3A-3H,the position of the left cell boundary 301 for each of the eightpossible cell phases is identified by a respective arrow labeledph1-ph8. Because the gate level and M2 level virtual grates areassociated with the logic block 103, their respective positions remainunchanged in each of FIGS. 3A-3H as the left cell boundary 301 isshifted through the eight possible phases (ph1-ph8).

It should be understood that the eight possible cell phases of FIGS.3A-3H are a result of the particular specifications of the exemplaryembodiment. For example, in another embodiment, if the phase space 303covered four gate level virtual grate pitches, but the cell could onlybe placed on the gate level virtual grate (whole) pitch, the number ofpossible cell phases would be four instead of eight, and wouldcorrespond to cell phases (ph1, ph3, ph5, ph7) as shown in FIGS. 3A-3H.

Generally speaking, a cell phase is defined by a combination of indexvalues for each of the chip levels associated with the phasing. Theindex value for a given chip level as used in defining a cell phaserepresents a distance measured perpendicularly between the left boundaryof the cell and the nearest virtual line of the given chip level'svirtual grate. It should be understood that each phased chip level of agiven cell has a corresponding index value. Also, it should beunderstood that a phased chip level of a cell is any chip level of thecell defined by a virtual grate that has a rational spatial relationshipwith a virtual grate of at least one other chip level of the cell. Also,as previously discussed, a rational spatial relationship exists betweentwo chip levels when each of the two chip levels is defined by commonlyoriented virtual grates that are indexed to a common spatial location,and have the ratio of their virtual grate pitches defined by a rationalnumber. In the exemplary embodiment of FIGS. 3A-3H, each cell phase(ph1-ph8) is defined by two index values: 1) G_(index), and 2) M2_(index), where G_(index) is the index value for the gate level and M2_(index) is the index value for the M2 level. As shown in FIGS. 3A-3H,each phase is defined by a unique combination of G_(index) and M2_(index) values.

The cell phasing example illustrated by FIGS. 3A-3H is based on avirtual grate phasing relationship in which the two virtual grates areindexed to periodically align with each other according to theirrational spatial relationship. It should be understood, however, that insome embodiments, virtual grates can be phased with each other withoutactually aligning with each other. For example, FIGS. 3I-3P illustrateanother embodiment in which the pitch ratio between the M2 level andgate level virtual grates is 4/3, and in which the M2 level virtualgrate is indexed in an offset relationship with the gate level virtualgrate, such that the M2 level and gate level virtual grates do not alignwith each other at any phase. The same concepts described with regard toFIGS. 3A-3H also apply to FIGS. 3I-3P. Generally speaking, it should beunderstood that the phase space 303′ in FIGS. 3I-3P is defined over anarea between extending successive occurrences of a same relationshipbetween the phased virtual grates. Specifically, at phase (ph1′) theindex value for the gate level is given by G_(index)=0, and the indexvalue for the M2 level is given by M2 _(index)=(⅙)*G_(pitch). Therefore,the phase space 303′ extends to a location where the phase (ph1′)reoccurs, i.e., where G_(index)=0 and M2 _(index)=(⅙)*G_(pitch). Forease of discussion, the remainder of the description herein is providedwith reference to the phasing as illustrated in FIGS. 3A-3H.

In one embodiment, a cell library is compiled to include a number ofdifferent cells defined in accordance with the dynamic arrayarchitecture, and further defined based on a particular rational spatialrelationship between particular chip levels. For example, with respectto the logic block 103 embodiment of FIGS. 2A-2B, a cell library can becompiled to include cells A-Z, where each of cells A-Z is defined inaccordance with the dynamic array architecture, and is further definedbased on a rational spatial relationship of 4/3 between the virtualgrate pitches of the M2 level and the gate level. To ensure that gatelevel and M2 level layouts of each cell in the library can be alignedwith the gate level and M2 level virtual grates of the logic block 103,regardless of cell placement within the logic block, the cell libraryshould include variants of each cell that respectively correspond toeach possible cell phase. Therefore, with regard to the embodiment ofFIGS. 2A-2B, the cell library should include eight different cellvariants (one for each cell phase) for each of cells A-Z. Variants ofcells A-Z for cell phases 1 through 8 may be identified as A-ph1, A-ph2,. . . Z-ph7, Z-ph8.

In one embodiment, cells may be first placed in the logic block 103without regard to cell phasing, as shown in FIG. 2B. Then, each placedcell can be replaced by an appropriate variant corresponding to therequired cell phase based on its exact position in the logic block 103,relative to the gate level and M2 level virtual grates of the logicblock 103. In another embodiment, appropriate cell variantscorresponding to the required cell phasing can be determined when thecells are initially placed in the logic block 103. FIG. 2C shows thecell placement of FIG. 2B, with an appropriate cell variant substitutedfor each cell based on the required cell phasing for the various cellplacements within the logic block 103.

As previously discussed, each cell phase is defined by the combinationof index values for the phased chip levels. Therefore, in order todetermine the appropriate cell phase to be used for a given cellplacement, the index values for the phased chip levels of the placedcell are calculated. Then, the calculated index values for the phasedchip levels of the placed cell are compared to the index values of thevarious cell phases to identify the matching cell phase. The matchingcell phase of the placed cell is then substituted for the placed cell.

For example, in the embodiment of FIG. 2B, each cell phase is defined bythe combination of the gate level index value (G_(index)) and the M2level index value (M2 _(index)). Therefore, in order to determine theappropriate cell phase to be used for a given cell placement, theG_(index) and the M2 _(index) values for the placed cell are calculated.Then, the calculated G_(index) and M2 _(index) values for the placedcell are compared to the G_(index) and M2 _(index) values of the variouscell phases to identify the matching cell phase. Then, the matching cellphase of the placed cell is substituted for the originally placed cell.

To illustrate further, consider the leftmost placed cell A of Row 1 inthe logic block 103 of FIG. 2B as the subject cell. The G_(index) valueof the subject cell is calculated to be zero, i.e., the left cellboundary 301 is aligned with the gate level virtual grate. The M2_(index) value of the subject cell is calculated to be zero, i.e., theleft cell boundary 301 is aligned with the M2 level virtual grate. Thecalculated index values of the subject cell (G_(pitch)=0, and M2_(index)=0) match the index values of cell phase 1, as shown in FIG. 3A.Therefore, cell phase 1 should be used for the subject cell, asindicated by corresponding cell A-ph1 in Row 1 of FIG. 2C.

To illustrate further, consider the rightmost placed cell U of Row 4 inthe logic block 103 of FIG. 2B as the subject cell. The G_(index) valueof the subject cell is calculated to be ((½)*G_(pitch)), whereinG_(pitch) is the gate level virtual grate pitch. The M2 _(index) valueof the subject cell is calculated to be ((⅙)*G_(pitch)). The calculatedindex values of the subject cell (G_(pitch)=((½)*G_(pitch)), and M2_(index)=((⅙)*G_(pitch))) match the index values of cell phase 6, asshown in FIG. 3F. Therefore, cell phase 6 should be used for the subjectcell, as indicated by corresponding cell U-ph6 in Row 4 of FIG. 2C.

FIG. 4 shows Row 1 of the logic block 103 of FIG. 2C, with exemplarygate level and M2 level layout shapes depicted for each cell therein.Due to specification of the appropriate cell phase for each cell in Row1, it can be seen that the gate level layout shapes of each cell alignwith the gate level virtual grate of the logic block 103, and the M2level layout shapes of each cell align with the M2 level virtual grateof the logic block 103.

The cell phasing methods described herein with regard to the M2level-to-gate level rational spatial relationship can be equally appliedto any plurality of chip levels. Additionally, the rational spatialrelationship between any two chip levels can be based on essentially anyvirtual grate pitch ratio between the two chip levels. For example,while the exemplary embodiments of FIGS. 2A-4 are based on a M2level-to-gate level pitch ratio of 4/3, the M2 level-to-gate level pitchratio in other embodiments may be 3/2, 5/3, 5/4, 2/3, 3/5, 4/5, etc.

It should be appreciated that the cell phasing methods described hereinprovide for maximum packing of cells within a given chip area, e.g.,logic block 103, without comprising adherence to the dynamic arrayarchitecture. In other words, the cell phasing methods described hereinallow cells to be placed cell boundary-to-cell boundary within the givenchip area, while ensuring that the layout shapes within the phased chiplevels of the cells align with virtual grates of the phased chip levels.Therefore, the cell phasing methods described herein alleviate the needto expand a width of a cell to accommodate alignment of layout featureswithin the cell to multiple virtual grates, thereby providing foroptimized chip area utilization in conjunction with use of the dynamicarray architecture. Additionally, the cell phasing methods describedherein alleviate the need to leave unoccupied chip area betweenadjacently placed cells to accommodate alignment of layout featureswithin the cell to multiple virtual grates, thereby providing foroptimized chip area utilization in conjunction with use of the dynamicarray architecture.

FIG. 5 is an illustration showing a flowchart of a method for definingcell variants of differing cell phase to enable placement of cellswithin an area of a semiconductor chip defined according to a dynamicarray architecture, in accordance with one embodiment of the presentinvention. It should be understood that the area on the semiconductorchip may correspond to an area that is substantially smaller than thetotal area of the semiconductor chip. The method includes an operation501 for identifying a phase space based on a rational spatialrelationship between virtual grates of phased chip levels. The virtualgrates of the phased chip levels represent part of the dynamic arrayarchitecture used to define the area of the semiconductor chip. Aspreviously discussed, the phase space is defined as a distance extendingperpendicularly between successive alignment positions of two virtualgrates that have a rational spatial relationship. For example, if firstand second virtual grates have a rational spatial relationship such thatthe first and second virtual grates align at every fourth virtual lineof the first virtual grate, then the phase space spans a distance offour times the pitch of the first virtual grate extending betweensuccessive alignments of the first and second virtual grates.

The method continues with an operation 503 in which a left boundary of asubject cell is aligned with a left edge of the phase space. Therefore,following operation 503, the left boundary of the subject cell issimultaneously aligned with a virtual line of each virtual grate of thephased chip levels. FIG. 3A shows an example of alignment between theleft boundary 301 of the cell 300 and the left edge of the phase space303. Thus, in the example of FIG. 3A, the left boundary 301 of the cell300 is simultaneously aligned with a virtual line of each virtual grateof the phased chip levels (i.e., the gate level and the M2 level).

With the left boundary of the subject cell aligned with the left edge ofthe phase space, the method continues with an operation 505 for defininga first phase of the subject cell based on locations of the virtualgrates of the phased chip levels relative to the left cell boundary. Thefirst phase of the subject cell represents a first variant of thesubject cell that is suitable for placement on the semiconductor chip ata location where the first phase of a given cell is required. The firstphase of the subject cell can be characterized by index values for eachphased chip level, where the index value for a given phased chip levelis defined as the distance measured perpendicularly between the leftboundary of the cell and the nearest virtual line of the given chiplevel's virtual grate within the phase space. FIGS. 3A-3H showcorresponding index values G_(index) and M2_(index) for the gate and M2phased chip levels. Operation 505 includes storage of the first phase ofthe subject cell in a cell library for future recall and use. In oneembodiment, the cell library is stored in a digital format on a computerreadable medium.

Following the operation 505, the method proceeds with an operation 507in which the left boundary of the cell is moved from its currentposition across the phase space to a next possible location of the leftboundary of the cell within the phase space. It should be understoodthat the left boundary of the cell is moved across the phase space inoperation 507 without moving the virtual grates of the phased chiplevels within the phase space. FIG. 3B shows an example of moving theleft boundary 301 of the cell 300 from its current position (i.e., fromits position in FIG. 3A) to the next possible location (ph2) of the leftboundary of the cell within the phase space 303.

If the particular dynamic array architecture embodiment for the area ofthe semiconductor chip allows for cell widths that are an integermultiple of the gate level virtual grate half-pitch, then the possiblelocations of the left cell boundary within the phase space correspond toeach gate level virtual grate line within the phase space and to eachmidpoint between each adjacent pair of gate level virtual grate lineswithin the phase space. This situation is exemplified in FIGS. 3A-3H. Ifthe particular dynamic array architecture embodiment for the area of thesemiconductor chip only allows cell widths that are an integer multipleof the gate level virtual grate (whole) pitch, then the possiblelocations of the left cell boundary within the phase space correspond toeither a gate level virtual grate line or a midpoint between an adjacentpair of gate level virtual grate lines within the phase space.

With the left boundary of the subject cell aligned with the nextpossible location of the left boundary of the cell within the phasespace, the method continues with an operation 509 for defining a nextphase of the subject cell based on locations of the virtual grates ofthe phased chip levels relative to the left cell boundary. This nextphase of the subject cell represents another variant of the subject cellthat is suitable for placement on the semiconductor chip at a locationwhere this next phase of a given cell is required. This next phase ofthe subject cell can also be characterized by index values for eachphased chip level. Operation 509 includes storage of this next phase ofthe subject cell in the cell library for future recall and use.

The method then proceeds with a decision operation 511 for determiningwhether another possible location of the left boundary of the cellexists within the phase space. If another possible location of the leftboundary of the cell does exist within the phase space, the methodreverts back to operation 507. However, if another possible location ofthe left boundary of the cell does not exist within the phase space, themethod concludes. Following completion of the method of FIG. 5, the celllibrary will include a variant of the subject cell for each possiblecell phase that may occur within the area on the semiconductor chipdefined according to the phased chip levels of the dynamic arrayarchitecture.

FIG. 6 is an illustration showing a flowchart of a method for placingcells within a portion of a semiconductor chip defined according to adynamic array architecture, in accordance with one embodiment of thepresent invention. The method includes an operation 601 for definingrespective virtual grates for each of two phased chip levels within theportion of the semiconductor chip. The two phased chip levels aredefined to have a rational spatial relationship. As previouslydiscussed, two virtual grates that are commonly oriented, indexed to acommon spatial location, and have the ratio of their virtual gratepitches defined by a rational number are considered to have a rationalspatial relationship. In one embodiment, the two phased chip levelscorrespond to a gate level and a second interconnect level. However, itshould be understood that in other embodiments, the two phased chiplevels can correspond to any two chip levels.

The method then proceeds with an operation 603 for placing cells withinthe portion of the chip. In one embodiment, the two phased chip levelsare indexed to a lower-left corner of the portion of the chip, and thecells are placed in rows extending from left to right across the portionof the chip. Also, in one embodiment, the cells can be placed such thattheir boundaries, which are commonly oriented with the virtual grates ofthe two phased chip levels, align with the half-pitch of the virtualgrate of the phased chip level having the smaller virtual grate pitch.

The method then proceeds with an operation 605 for determining the cellphase required for each cell placed in operation 603. In one embodiment,the required cell phase for a given cell is identified by index valuesfor the phased chip levels within the placed cell. Again, the indexvalue for a given phased chip level within the placed cell is defined asthe distance measured perpendicularly between the left boundary of theplaced cell and the nearest virtual line of the given phased chiplevel's virtual grate within the placed cell, i.e., the nearest virtualline of the given phased chip level virtual grate that is to the rightof the left boundary of the cell. Calculated index values for the phasedchip levels of each placed cell can be compared to corresponding indexvalues of variants of the same placed cell within a cell library toidentify a particular variant of the same placed cell having therequired cell phase. An operation 607 is then performed to substitutefor each placed cell the particular variant of the placed cell that hasthe required cell phase, thereby causing the layout features in thephased chip levels of each placed cell to align with the virtual gratesof the phased chip levels defined across the portion of thesemiconductor chip.

Based on the foregoing, in one embodiment, a semiconductor chip isdefined to include a logic block area. The logic block area includes afirst chip level in which layout features are placed according to afirst virtual grate. The logic block area also includes a second chiplevel in which layout features are placed according to a second virtualgrate. A rational spatial relationship exists between the first andsecond virtual grates. A number of cells are placed within the logicblock area. Each of the number of cells is defined according to anappropriate one of a number of cell phases. The appropriate cell phasecauses layout features in the first and second chip levels of a givenplaced cell to be aligned with the first and second virtual grates aspositioned within the given placed cell. It should be understood that agiven cell defined in accordance with either of the number of cellphases is defined to perform a same logic function associated with thegiven cell. Moreover, in one embodiment, it is of interest to defineeach variant of a given cell, corresponding to the various cell phases,to have similar electrical characteristics. Also, in one embodiment,some of the number of cells include at least one layout feature placedin either the first chip level or the second chip level in asubstantially centered manner along a cell boundary that is parallel tovirtual lines of the first and second virtual grates.

In one embodiment, the number of cells are placed in rows within thelogic block area, such that interfacing cell boundaries are co-aligned.Also, in one embodiment, a height of each of the number of cells isuniform. The height of each of the number of cells is measured in adirection parallel to virtual lines of the first and second virtualgrates. Additionally, in one embodiment, a width of each of the numberof cells is an integer multiple of a pitch of the first virtual grate,and each boundary of each placed cell (that is parallel to virtual linesof the first virtual grate) is aligned with a virtual line of the firstvirtual grate. In another embodiment, a width of each of the number ofcells is an integer multiple of a pitch of the first virtual grate, andeach boundary of each placed cell (that is parallel to virtual lines ofthe first virtual grate) is aligned with a midpoint between adjacentvirtual lines of the first virtual grate. In yet another embodiment, awidth of each of the number of cells is an integer multiple of one-halfof a pitch of the first virtual grate, and each boundary of each placedcell (that is parallel to virtual lines of the first virtual grate) isaligned with either a virtual line of the first virtual grate or amidpoint between adjacent virtual lines of the first virtual grate.

Additionally, while the above-described embodiments are discussed withinthe context of phasing each cell placed within a given logic block, itshould be understood that in an alternative embodiment, the cell phasingmethods described herein may be applied to a portion of the cells placedwithin a given logic block, with a remainder of the cells in the logicblock left unphased. For instance, if a first group of cells in a givenlogic block are defined according to the dynamic array architecture andutilize appropriate phasing when placed, and a second group of cells inthe given logic block are defined by another architecture (i.e.,non-dynamic array architecture) that does not utilize phasing, the firstgroup of cells can be placed and phased in accordance with the methodsdisclosed herein, and the second group of cells can be left unphased.

As discussed in co-pending U.S. patent application Ser. No. 12/013,342,which is incorporated in its entirety herein by reference, a dynamicarray section (DAS) is defined as a subdivision of dynamic arrayarchitecture in which the features present in each vertically delineatedlevel of the subdivision are defined with consideration of otherfeatures in the subdivision according to a set of rules, wherein therules are established to govern relationships between features in agiven level of the subdivision and between features in separate levelsof the subdivision. A DAS can be defined to occupy a substrate area ofarbitrary shape and size. A DAS can also be defined to occupy an area ofarbitrary shape and size above the substrate.

Also, as discussed in co-pending U.S. patent application Ser. No.12/013,342, conductive features in a given level of a logic cell, i.e.,in a given level of a DAS containing the logic cell, can be indexedrelative to an origin of the logic cell. For example, the origin of thelogic cell in a given level is considered to be located at a lower leftcorner of the logic cell when viewed in a direction perpendicular to theplane of the substrate. Because logic cell widths are variable, a logiccell boundary in the width direction may not always fall on a conductivefeature pitch or half-pitch within a given DAS level. Therefore,depending on the origin of the logic cell relative to the virtual grateof the given DAS level, the conductive features in the given DAS levelof the logic cell may need to be shifted relative to the logic cellorigin in order to align with the virtual grate of the given DAS levelwhen the logic cell is placed on the chip. As discussed above, theshifting of conductive features in a given level of a logic cellrelative of the origin of the logic cell is called phasing. Therefore,phasing provides for alignment of conductive features in a given levelof a logic cell to the virtual grate of the DAS for the given chiplevel, depending on the location of the origin of the logic cell. Forexample, in the case where the gate electrode virtual grate extendsacross logic cell boundaries, phasing may be required to maintainalignment of second interconnect level conductive features in a givenlogic cell to the second interconnect level virtual grate.

FIG. 7 is an illustration showing an example of different phasings in asecond interconnect level of adjacently disposed logic cells definedwithin a DAS, in accordance with one embodiment of the presentinvention. FIG. 7 corresponds to FIG. 33 of co-pending U.S. patentapplication Ser. No. 12/013,342. FIG. 7 shows three exemplary cells(Cell 1, Phase A; Cell 1, Phase B; and Cell 1, Phase C) disposedadjacent to each other in a DAS. Therefore, each of the three cellsshare a virtual grate in each level of the DAS. To facilitatedescription of the phasing concept, the second interconnect levelconductive features 3303 of each cell are shown superimposed over thegate electrode level conductive features 3301 of each cell. The cellboundaries in the width direction fall on the gate electrode half-pitch.

It should be understood that the M2 level-to-gate level virtual gratepitch ratio of 4/3 as used in the examples of FIGS. 2A-4 to illustratethe cell phasing principles is one example of many possible virtualgrate pitch ratios that can be applied between different chip levels.For instance, in the exemplary embodiment of FIG. 7, an M2 level-to-gatelevel virtual grate pitch ratio of 3/4 is used, such that four secondinterconnect level conductive feature pitches are provided for everythree gate electrode level conductive feature pitches.

The origin of each cell is shown to reside at the cell's lower leftcorner. Each phasing of Cell 1 for the second interconnect level isdefined by an indexing of the second interconnect level conductivefeatures to the origin of the cell. As shown in the example of FIG. 7,the index, i.e., spacing, of the second interconnect level conductivefeatures relative to the origin is consecutively reduced for each ofPhases A, B, and C. By defining each level of each logic cell to have anappropriate phase, it is possible to place logic cells next to oneanother in a common DAS such that conductive features defined within thevarious logic cells within a given DAS level can be aligned to a commonvirtual grate associated with the given DAS level. Additionally, itshould be appreciated that in one embodiment adjacent cells within a DAScan be defined and placed so as to share conductive features in one ormore levels of the DAS. For example, the Phase B and C instances of Cell1 in FIG. 7 are depicted as sharing a second interconnect levelconductive feature.

It should be understood that in some embodiments the dynamic arrayarchitecture may only be applied to a portion of one chip level, withoverlying portions of other chip levels unconstrained with respect todynamic array architecture restrictions. For example, in one embodiment,the gate electrode level is defined to comply with the dynamic arrayarchitecture, and the higher interconnect levels are defined in anunconstrained manner, i.e., in a non-dynamic array manner. In thisembodiment, the gate electrode level is defined by a virtual grate andits corresponding feature layout channels within which gate electrodelevel conductive features are defined, as discussed above. Also, in thisembodiment, the layout features of the non-dynamic array higherinterconnect levels can be unconstrained with regard to a virtual grateand associated feature layout channels. For instance, in this particularembodiment, layout features in any interconnect level above the gateelectrode level can include bends so as to form arbitrarytwo-dimensionally shaped layout features.

As an alternative to the above-mentioned embodiment, other embodimentscan exist in which multiple chip levels are defined according to thedynamic array architecture. It should be understood that the phasingtechniques disclosed herein are equally applicable to any embodimentthat uses the dynamic array architecture, regardless of the number ofchip levels that are defined according to the dynamic arrayarchitecture.

It should be understood that the cell phasing techniques as disclosedherein can be defined in a layout that is stored in a tangible form,such as in a digital format on a computer readable medium. For example,the cell phasing layouts as disclosed herein can be stored in a layoutdata file of one or more cells, selectable from one or more libraries ofcells. The layout data file can be formatted as a GDS II (Graphic DataSystem) database file, an OASIS (Open Artwork System InterchangeStandard) database file, or any other type of data file format suitablefor storing and communicating semiconductor device layouts. Also,multi-level layouts utilizing the cell phasing techniques can beincluded within a multi-level layout of a larger semiconductor device.The multi-level layout of the larger semiconductor device can also bestored in the form of a layout data file, such as those identifiedabove.

Also, the invention described herein can be embodied as computerreadable code 903 on a computer readable medium 901, as shown in FIG. 9.For example, the computer readable code 903 can include the layout datafile 905 within which one or more layouts including the cell phasingtechniques are stored. The computer readable code 903 can also includeprogram instructions 907 for selecting one or more layout libraries 909and/or cells 911 that include a layout utilizing the cell phasingtechniques as defined therein. The layout libraries 909 and/or cells 911can also be stored in a digital format on a computer readable medium901.

The computer readable medium mentioned herein is any data storage devicethat can store data which can thereafter be read by a computer system.Examples of the computer readable medium include hard drives, networkattached storage (NAS), read-only memory, random-access memory, CD-ROMs,CD-Rs, CD-RWs, magnetic tapes, and other optical and non-optical datastorage devices. The computer readable medium can also be distributedover a network of coupled computer systems so that the computer readablecode is stored and executed in a distributed fashion.

Any of the operations described herein that form part of the inventionare useful machine operations. The invention also relates to a device oran apparatus for performing these operations. The apparatus may bespecially constructed for the required purpose, such as a specialpurpose computer. When defined as a special purpose computer, thecomputer can also perform other processing, program execution orroutines that are not part of the special purpose, while still beingcapable of operating for the special purpose. Alternatively, theoperations may be processed by a general purpose computer selectivelyactivated or configured by one or more computer programs stored in thecomputer memory, cache, or obtained over a network. When data isobtained over a network the data maybe processed by other computers onthe network, e.g., a cloud of computing resources.

The embodiments of the present invention can also be defined as amachine that transforms data from one state to another state. The datamay represent an article, that can be represented as an electronicsignal and electronically manipulate data. The transformed data can, insome cases, be visually depicted on a display, representing the physicalobject that results from the transformation of data. The transformeddata can be saved to storage generally, or in particular formats thatenable the construction or depiction of a physical and tangible object.In some embodiments, the manipulation can be performed by a processor.In such an example, the processor thus transforms the data from onething to another. Still further, the methods can be processed by one ormore machines or processors that can be connected over a network. Eachmachine can transform data from one state or thing to another, and canalso process data, save data to storage, transmit data over a network,display the result, or communicate the result to another machine.

It should be further understood that the cell phasing embodiments asdisclosed herein can be manufactured as part of a semiconductor deviceor chip. In the fabrication of semiconductor devices such as integratedcircuits, memory cells, and the like, a series of manufacturingoperations are performed to define features on a semiconductor wafer.The wafer includes integrated circuit devices in the form of multi-levelstructures defined on a silicon substrate. At a substrate level,transistor devices with diffusion regions are formed. In subsequentlevels, interconnect metallization lines are patterned and electricallyconnected to the transistor devices to define a desired integratedcircuit device. Also, patterned conductive layers are insulated fromother conductive layers by dielectric materials.

While this invention has been described in terms of several embodiments,it will be appreciated that those skilled in the art upon reading thepreceding specifications and studying the drawings will realize variousalterations, additions, permutations and equivalents thereof. Therefore,it is intended that the present invention includes all such alterations,additions, permutations, and equivalents as fall within the true spiritand scope of the invention.

What is claimed is:
 1. A semiconductor chip, comprising: a plurality ofcells positioned in a side-by-side manner, the plurality of cellsincluding linear-shaped conductive structures formed in a first chiplevel and linear-shaped conductive structures formed in a second chiplevel, the linear-shaped conductive structures formed in the first chiplevel oriented to extend lengthwise in a first direction, thelinear-shaped conductive structures formed in the second chip leveloriented to extend lengthwise in the first direction, wherein thelinear-shaped conductive structures in the first chip level arepositioned in accordance with a first uniform pitch across the pluralityof cells such that a distance as measured in a second directionperpendicular to the first direction between lengthwise centerlines ofany two of the linear-shaped conductive structures in the first chiplevel is an integer multiple of the first uniform pitch, wherein thelinear-shaped conductive structures in the second chip level arepositioned in accordance with a second uniform pitch across theplurality of cells such that a distance as measured in a seconddirection perpendicular to the first direction between lengthwisecenterlines of any two of the linear-shaped conductive structures in thesecond chip level is an integer multiple of the second uniform pitch,wherein each of the plurality of cells is configured in accordance withany one of an even integer number of possible phases, wherein each ofthe even integer number of possible phases for a given one of theplurality of cells is defined by a specific spatial relationship betweenthe first uniform pitch locations in the first chip level and the seconduniform pitch locations in the second chip level across the given one ofthe plurality of cells.
 2. The semiconductor chip as recited in claim 1,wherein each of the possible phases for a given one of the plurality ofcells is defined by a first index for the first chip level and a secondindex for the second chip level, wherein the first index corresponds toa first distance as measured in the second direction from a leftmostboundary of the given one of the plurality of cells to a first availableposition for placement of a linear-shaped conductive structure withinthe first chip level of the given one of the plurality of cells, andwherein the second index corresponds to a second distance as measured inthe second direction from a leftmost boundary of the given one of theplurality of cells to a first available position for placement of alinear-shaped conductive structure within the second chip level of thegiven one of the plurality of cells.
 3. The semiconductor chip asrecited in claim 2, wherein the first index of each of the possiblephases is equal to zero.
 4. The semiconductor chip as recited in claim2, wherein the first index of each of the possible phases is equal toeither zero or one-half of the first uniform pitch.
 5. The semiconductorchip as recited in claim 4, wherein the even integer number of possiblephases is eight.
 6. The semiconductor chip as recited in claim 5,wherein four times the first uniform pitch is equal to three times thesecond uniform pitch.
 7. The semiconductor chip as recited in claim 6,wherein a first phase of the possible phases is defined by the firstindex equal to zero and by the second index equal to zero, wherein asecond phase of the possible phases is defined by the first index equalto one-half times the first uniform pitch and by the second index equalto five-sixths times the first uniform pitch, wherein a third phase ofthe possible phases is defined by the first index equal to zero and bythe second index equal to one-third times the first uniform pitch,wherein a fourth phase of the possible phases is defined by the firstindex equal to one-half times the first uniform pitch and by the secondindex equal to seven-sixths times the first uniform pitch, wherein afifth phase of the possible phases is defined by the first index equalto zero and by the second index equal to two-thirds times the firstuniform pitch, wherein a sixth phase of the possible phases is definedby the first index equal to one-half times the first uniform pitch andby the second index equal to one-sixth times the first uniform pitch,wherein a seventh phase of the possible phases is defined by the firstindex equal to zero and by the second index equal to the first uniformpitch, wherein an eighth phase of the possible phases is defined by thefirst index equal to one-half times the first uniform pitch and by thesecond index equal to one-half times the first uniform pitch.
 8. Thesemiconductor chip as recited in claim 6, wherein a first phase of thepossible phases is defined by the first index equal to zero and by thesecond index equal to one-sixth times the first uniform pitch, wherein asecond phase of the possible phases is defined by the first index equalto one-half times the first uniform pitch and by the second index equalto the first uniform pitch, wherein a third phase of the possible phasesis defined by the first index equal to zero and by the second indexequal to one-half times the first uniform pitch, wherein a fourth phaseof the possible phases is defined by the first index equal to one-halftimes the first uniform pitch and by the second index equal tofour-thirds times the first uniform pitch, wherein a fifth phase of thepossible phases is defined by the first index equal to zero and by thesecond index equal to five-sixths times the first uniform pitch, whereina sixth phase of the possible phases is defined by the first index equalto one-half times the first uniform pitch and by the second index equalto one-third times the first uniform pitch, wherein a seventh phase ofthe possible phases is defined by the first index equal to zero and bythe second index equal to seven-sixths times the first uniform pitch,wherein an eighth phase of the possible phases is defined by the firstindex equal to one-half times the first uniform pitch and by the secondindex equal to two-thirds times the first uniform pitch.
 9. Thesemiconductor chip as recited in claim 5, wherein four times the firstuniform pitch is equal to five times the second uniform pitch.
 10. Thesemiconductor chip as recited in claim 9, wherein a first phase of thepossible phases is defined by the first index equal to zero and by thesecond index equal to zero, wherein a second phase of the possiblephases is defined by the first index equal to one-half times the firstuniform pitch and by the second index equal to three-tenths times thefirst uniform pitch, wherein a third phase of the possible phases isdefined by the first index equal to zero and by the second index equalto three-fifths times the first uniform pitch, wherein a fourth phase ofthe possible phases is defined by the first index equal to one-halftimes the first uniform pitch and by the second index equal to one-tenthtimes the first uniform pitch, wherein a fifth phase of the possiblephases is defined by the first index equal to zero and by the secondindex equal to two-fifths times the first uniform pitch, wherein a sixthphase of the possible phases is defined by the first index equal toone-half times the first uniform pitch and by the second index equal toseven-tenths times the first uniform pitch, wherein a seventh phase ofthe possible phases is defined by the first index equal to zero and bythe second index equal to one-fifth times the first uniform pitch,wherein an eighth phase of the possible phases is defined by the firstindex equal to one-half times the first uniform pitch and by the secondindex equal to one-half times the first uniform pitch.
 11. Thesemiconductor chip as recited in claim 4, wherein the even integernumber of possible phases is four.
 12. The semiconductor chip as recitedin claim 11, wherein two times the first uniform pitch is equal to threetimes the second uniform pitch.
 13. The semiconductor chip as recited inclaim 12, wherein a first phase of the possible phases is defined by thefirst index equal to zero and by the second index equal to zero, whereina second phase of the possible phases is defined by the first indexequal to one-half times the first uniform pitch and by the second indexequal to one-sixth times the first uniform pitch, wherein a third phaseof the possible phases is defined by the first index equal to zero andby the second index equal to one-third times the first uniform pitch,wherein a fourth phase of the possible phases is defined by the firstindex equal to one-half times the first uniform pitch and by the secondindex equal to one-half times the first uniform pitch.
 14. Thesemiconductor chip as recited in claim 4, wherein the even integernumber of possible phases is six.
 15. The semiconductor chip as recitedin claim 14, wherein three times the first uniform pitch is equal to twotimes the second uniform pitch.
 16. The semiconductor chip as recited inclaim 15, wherein a first phase of the possible phases is defined by thefirst index equal to zero and by the second index equal to zero, whereina second phase of the possible phases is defined by the first indexequal to one-half times the first uniform pitch and by the second indexequal to the first uniform pitch, wherein a third phase of the possiblephases is defined by the first index equal to zero and by the secondindex equal to one-half times the first uniform pitch, wherein a fourthphase of the possible phases is defined by the first index equal toone-half times the first uniform pitch and by the second index equal tozero, wherein a fifth phase of the possible phases is defined by thefirst index equal to zero and by the second index equal to the firstuniform pitch, wherein a sixth phase of the possible phases is definedby the first index equal to one-half times the first uniform pitch andby the second index equal to one-half times the first uniform pitch. 17.The semiconductor chip as recited in claim 14, wherein three times thefirst uniform pitch is equal to five times the second uniform pitch. 18.The semiconductor chip as recited in claim 17, wherein a first phase ofthe possible phases is defined by the first index equal to zero and bythe second index equal to zero, wherein a second phase of the possiblephases is defined by the first index equal to one-half times the firstuniform pitch and by the second index equal to one-tenth times the firstuniform pitch, wherein a third phase of the possible phases is definedby the first index equal to zero and by the second index equal toone-fifth times the first uniform pitch, wherein a fourth phase of thepossible phases is defined by the first index equal to one-half timesthe first uniform pitch and by the second index equal to three-tenthstimes the first uniform pitch, wherein a fifth phase of the possiblephases is defined by the first index equal to zero and by the secondindex equal to two-fifths times the first uniform pitch, wherein a sixthphase of the possible phases is defined by the first index equal toone-half times the first uniform pitch and by the second index equal toone-half times the first uniform pitch.
 19. The semiconductor chip asrecited in claim 4, wherein the even integer number of possible phasesis ten.
 20. The semiconductor chip as recited in claim 19, wherein fivetimes the first uniform pitch is equal to three times the second uniformpitch.
 21. The semiconductor chip as recited in claim 20, wherein afirst phase of the possible phases is defined by the first index equalto zero and by the second index equal to zero, wherein a second phase ofthe possible phases is defined by the first index equal to one-halftimes the first uniform pitch and by the second index equal toseven-sixths times the first uniform pitch, wherein a third phase of thepossible phases is defined by the first index equal to zero and by thesecond index equal to two-thirds times the first uniform pitch, whereina fourth phase of the possible phases is defined by the first indexequal to one-half times the first uniform pitch and by the second indexequal to one-sixth times the first uniform pitch, wherein a fifth phaseof the possible phases is defined by the first index equal to zero andby the second index equal to four-thirds times the first uniform pitch,wherein a sixth phase of the possible phases is defined by the firstindex equal to one-half times the first uniform pitch and by the secondindex equal to five-sixth times the first uniform pitch, wherein aseventh phase of the possible phases is defined by the first index equalto zero and by the second index equal to one-third times the firstuniform pitch, wherein a eighth phase of the possible phases is definedby the first index equal to one-half times the first uniform pitch andby the second index equal to three-halves times the first uniform pitch,wherein a ninth phase of the possible phases is defined by the firstindex equal to zero and by the second index equal to the first uniformpitch, wherein a tenth phase of the possible phases is defined by thefirst index equal to one-half times the first uniform pitch and by thesecond index equal to one-half times the first uniform pitch.
 22. Thesemiconductor chip as recited in claim 19, wherein five times the firstuniform pitch is equal to four times the second uniform pitch.
 23. Thesemiconductor chip as recited in claim 22, wherein a first phase of thepossible phases is defined by the first index equal to zero and by thesecond index equal to zero, wherein a second phase of the possiblephases is defined by the first index equal to one-half times the firstuniform pitch and by the second index equal to three-fourths times thefirst uniform pitch, wherein a third phase of the possible phases isdefined by the first index equal to zero and by the second index equalto one-fourth times the first uniform pitch, wherein a fourth phase ofthe possible phases is defined by the first index equal to one-halftimes the first uniform pitch and by the second index equal to the firstuniform pitch, wherein a fifth phase of the possible phases is definedby the first index equal to zero and by the second index equal toone-half times the first uniform pitch, wherein a sixth phase of thepossible phases is defined by the first index equal to one-half timesthe first uniform pitch and by the second index equal to zero, wherein aseventh phase of the possible phases is defined by the first index equalto zero and by the second index equal to three-fourths times the firstuniform pitch, wherein a eighth phase of the possible phases is definedby the first index equal to one-half times the first uniform pitch andby the second index equal to one-fourth times the first uniform pitch,wherein a ninth phase of the possible phases is defined by the firstindex equal to zero and by the second index equal to the first uniformpitch, wherein a tenth phase of the possible phases is defined by thefirst index equal to one-half times the first uniform pitch and by thesecond index equal to one-half times the first uniform pitch.